SiliconPr0n wiki page: http://siliconpr0n.org/archive/doku.php?id=honeywell_awm2100v
The part number is clearly visible, it's a Honeywell AWM2100V airflow sensor. Some of my analysis from earlier was a bit off - it turns out that there's two ports on the device and some of the resistors on the membrane are heaters. One of the resistive elements is driven with a constant power and the resistance of the other one is measured to determine the membrane's temperature. Given the power input and the temperature increase above ambient (compared to unheated regions of the die and board) one can compute the airflow rate.
I tore this one down to the bare board but no further, die/board photos from the other unit are in part 1 of the post.
Sensor on the PCB |
I removed the sensor from the board using hot air. It's a six-pin SIL package with a plastic case snapped around the sensor board.
Packaging of sensor after removing from board |
After removing the snapped-on casing we're left with the ceramic sensor board and a hose fitting on top. Under the host fitting is the actual sensor die, studied in detail in the previous post.
Fully disassembled |
In the board and package-level integrated systems, the MEMS and ASIC die remain two separate die, fabricated independently. Thus, each die may be developed and updated separately. The separation of the MEMS and ASIC die facilitates product differentiation. For example, in an accelerometer product family, accelerometers of different ranges or performance levels could use the same ASIC , but may be differentiated by using different MEMS accelerometers. what is thought leadership marketing
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